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Intel Demo's Mobile WiMAX Chip Print E-mail
Written by Adam Gosling   
Friday, 08 December 2006
Intel, a strong proponent of WiMAX, announced it has completed the design of its first mobile WiMAX baseband chip to complement its dual WiMAX/Wi-Fi chip.

The completed chipset will allow Intel to offer mobile/fixed WiMax and 802.11n, or as Intel calls "always best connected" mobile Internet experience.

The Intel WiMAX Connection 2300 chipset design was demonstrated during at the 3G World Congress in Hong Kong this week.

The demo consisted of an Intel Centrino Duo laptop that supported 802.16e-2005 (mobile WiMAX) 802.11n and 3G HSDPA.

The company said the completed design brings it a step closer to an integrated wireless system-on-chip that will help drive WiMAX adoption by maximising useable space in mobile devices.

As laptops become smaller, for example, they will have limited space for new technologies. Integration also helps enable ubiquitous connectivity on ultra mobile PCs, consumer electronics and handheld devices that have significant size constraints for the number of cards or components.

Intel's support for Wi-Fi MIMO functionality on the baseband chip will enhance the signal quality and throughput of wireless bandwidth, it said.

The baseband chip also employs the same software for Intel's WiMAX and Wi-Fi solutions to help ensure unified management for connectivity.

Over-the-air provisioning supports easy configuration and enables consumer activation of services, shifting the traditional hands on service provider business model to a direct activation one based purely on consumer purchases of mobile devices.

The baseband chip also has low power requirements for increased battery life and lower thermals to support smaller and thinner designs.

Intel hopes have samples of a PC card and chipset module for system makers early next year.
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